Prime Highlights:
- Delvitech has raised $40 million in Series B funding to expand its electronics inspection technology.
- The company develops 3D inspection systems that detect and classify defects in challenging materials like plastic parts and transparent adhesives.
Key Facts:
- Delvitech plans to produce more than 200 machines per month by 2030.
- The funding round was led by EGS Beteiligungen (EGSB), with participation from CREADD Ventures and other European investors.
Background:
Swiss company Delvitech has secured $40 million to grow its electronics inspection technology. The funding round was led by EGS Beteiligungen (EGSB), the Investment Company of the Ernst Göhner Foundation, with support from CREADD Ventures and other European investors.
Delvitech makes 3D inspection systems that can find and identify defects in tricky materials like plastic parts and clear adhesives on electronic boards. The system provides full visibility of printed circuit boards, covering micro-pitch connectors, mechanical components, and more.
The company also works on predicting potential errors to improve quality control efficiency. Roberto Gatti, founder and CEO of Delvitech, says the platform is built to be flexible and adaptable for use in multiple industries.
“Thanks to our proprietary predictive technology, we are paving the way to prevent errors rather than merely detecting them,” Gatti said. “Our AI-native platform enables faster deployment, higher precision, and reduced operating costs for manufacturers.”
Delvitech’s technology is already being used in sectors such as automotive, telecommunications, EMS, IoT, pharmaceuticals, defence, and industrial automation, with plans to expand into semiconductors. The self-learning AI adapts to production dynamics, minimising the need for manual programming.
Looking ahead, Delvitech plans to expand its global footprint, with a particular focus on India, where it intends to open a manufacturing facility in 2026. The company plans to produce more than 200 machines each month by 2030.
